Advanced Glue Dispensing System for FPC Package Applications

Customization:	Available
After-sales Service:	Provided
Precision:	High Precision

Overview & Basic Info

Model NO.:DK-04

Condition:New

Certification:ISO, CE

Warranty:12 Months

Automatic Grade:Automatic

Installation:Desktop

Driven Type:Electric

Product Name:Dispensing Machine

Working Area:X: 260mm, Y: 260mm, Z: 100mm

Max Speed:800 mm/S

Repeatability:+/- 0.025 mm

Weight:105 Kg

Product Description

Standard Features

Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point
CE certified

Optional Features

Automatic constant temperature system for consistent fluidity
Laser Height Detection for automatic Z-axis calibration

Key Features & Advantages

🚀 Ultra-Precise Dispensing: Repeatability of ±0.025mm, ideal for micro-dots, underfill, and die-attach adhesives. Max speed reaching 800mm/s for high-throughput production.

👁️ Smart CCD Vision Alignment: Automated pattern recognition compensates for substrate misalignment with real-time inspection to detect errors.

💻 Semiconductor-Grade Control: Industrial PC + High-Speed Motion Control Card using user-friendly software with drag-and-drop programming. Supports SECS/GEM Protocol.

🛡️ Reliability & Cleanroom Compatibility: Vacuum Nozzle Cleaning System prevents clogging. Anti-static design (ESD) and low-particulate construction suitable for ISO Class 5-8 cleanrooms.

Product Parameters

Applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder paste dispensing, LED package, fingerprint identification module, etc.

Specifications	TSV-300	HSV-300
Dimension (mm)	L810×W660×H760	L900×W650×H1460
Weight (kg)	105	190
Control	Industrial PC + motion control card
Software	Anda control software + Windows system
Working area (mm)	X:260 ; Y:260 ; Z:100
Max. Moving speed	800 mm/s
Repeatability	± 0.025 mm
Power supply	220V 50/60Hz
Safety Standards	CE

Applications

Semiconductor & Advanced Electronics

Flip-Chip Underfill Dispensing
Die Attach Adhesive Application
Wafer-Level Packaging (WLP) Encapsulation
Advanced PCB Assembly (SiP, Fan-Out)
MEMS & Sensor Packaging

Exhibition & Global Reach

Engaged in international trade and integration of semiconductor industry equipment, exported to over 30 countries with over 200 customers. Main focus: Die Bonder, Wire Bonding, Laser Marking, Laser Grooving, and Automatic Silicone Dispensing Equipment.

Packaging & Shipping

📦 Secure Packaging: Equipment is protected with shock-absorbing bubble foam inside robust wooden crates for maximum transit safety.

🚢 Global Logistics: Reliable management of road, sea, and air freight to meet global timeline and budget requirements.

Frequently Asked Questions

Q1: How to choose a suitable dispensing machine?

A1: You can specify the workpiece material, dimensions, and your specific process requirements. Based on our experience, we will recommend the most suitable configuration for your application.

Q2: What is the warranty period for the equipment?

A2: We provide a one-year warranty and 24-hour online professional technical support to ensure your production remains uninterrupted.

Q3: Does the machine support high-precision semiconductor applications?

A3: Yes, with a repeatability of ±0.025 mm and CCD visual positioning, it is specifically designed for underfill, die-attach, and micro-dot dispensing in semiconductor environments.

Q4: Can the machine be integrated into a smart factory?

A4: Absolutely. The system supports SECS/GEM Protocol, which is the standard for communication between equipment and host systems in automated semiconductor factories.

Q5: Is the equipment compatible with cleanroom environments?

A5: Yes, the system features a low-particulate construction and anti-static (ESD) design, making it suitable for ISO Class 5-8 cleanroom operations.

Q6: How is the Z-axis calibrated for components with deformation?

A6: We offer an optional Laser Height Detection system that automatically detects and calibrates the Z-axis height to compensate for any component or substrate deformation.