Advanced Laser Wafer Marking System for Semiconductor Production

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Advanced Laser Wafer Marking System for Semiconductor Production

Customization:	Available
After-sales Service:	Online Service
Warranty:	12 Months

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Product Description

Basic Specifications

Model NO.	HMLY-DB-005
Laser Visibility	Visible
Applicable Material	Metal / Semiconductor
Cooling System	Air Cooling / Water Cooling Options
Laser Wave	355nm / 532nm / 1064nm
Laser Power	4W / 7W / 10W / 15W / 25W
Type	Semiconductor Laser Marking Machine
Sub-Micron Accuracy	Precision Alignment for <10μm Marks
Material Versatility	Si, GaAs, Sic, and Compound Wafers
Traceability	Semi T7 & Secs/Gem Standards

Product Description

Automatic 8-12 Inches Wafer Marking Equipment

The Wafer Marking Machine is a high-precision, automated system designed for the laser marking of semiconductor wafers with 8-12-inch compatibility. It integrates robotic handling, automatic calibration, and advanced laser marking to ensure efficient and clean processing. The machine supports SECS/GEM communication and can be customized for various marking patterns, including barcodes (SEMI T1) and QR codes, while maintaining ISO Class 2 cleanliness.

Technical Specification

Parameter	Details
Laser Wavelength	532nm
Cooling Method	Water Cooling
Control System	Galvanometer + Control Card (Windows 7/10)
Supported Formats	DXF, PLT
Power Supply	Single-Phase 220V, 4KW
Optional Features	QR Code (DM), Custom Marking Designs

Key Features & Working Conditions

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High-Precision Marking

Equipped with 532nm laser for clear and durable wafer markings.

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Automated Handling

Dual-arm robotic system with ±0.1mm repeatability for loading/unloading.

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Auto-Calibration

3-second center and angle detection for accurate positioning.

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Working Environment

Temp: 20-25°C; Humidity: 35-60%; Power: 220VAC, 50Hz.

Main Applications

Semiconductor Manufacturing

Unique Wafer Marking (UWM) for 8-12 inch wafers; Lot & Batch Tracking.

LED & Optoelectronics

Laser Marking for Mini/Micro-LEDs on GaN, SiC, and sapphire wafers.

Automotive & Power Electronics

SiC & GaN Power Devices for EV inverters and industrial modules.

MEMS & Advanced Packaging

Identifies MEMS wafers before dicing; glass-frit sealed medical applications.

Frequently Asked Questions

Q1: What is a Wafer Marking Machine? A: It's a high-precision laser system designed to permanently mark wafers (Si, GaN, SiC, sapphire, etc.) with barcodes, QR codes, or alphanumeric IDs for traceability.

Q2: Which wafer sizes are compatible with this equipment? A: This machine is specifically designed for high-precision, automated handling and marking of 8-inch to 12-inch wafers.

Q3: What types of lasers can be used for different materials? A: Fiber Lasers (1064nm) for metals and Si/SiC; UV Lasers (355nm) for delicate wafers like GaN and sapphire; and Green Lasers (532nm) for glass and ceramics.

Q4: What is the marking resolution of the system? A: The system provides sub-micron accuracy with a marking resolution up to 10 μm (microns), suitable for miniaturized dies.

Q5: Does the machine support industry communication standards? A: Yes, it supports SECS/GEM communication standards for seamless integration into semiconductor factory automation systems.

Q6: Is the machine suitable for cleanroom environments? A: Yes, it is designed for ISO Class 2 cleanliness and can include optional FFU (H14 filter) and dust extraction systems.