High-Performance Laser Drilling System for Rapid Material Processing

Customization: Available
After-sales Service: One Year Warranty
Warranty: One Year Warranty

Product Description

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Overview & Specifications
Model NO.
AT-61166
Trademark
ANTTRANS
Origin
China
Package Size
150.00cm * 90.00cm * 150.00cm
Gross Weight
2000.000kg
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Product Description
The Laser High-Speed Drilling System is a galvanometer-based precision laser processing equipment that combines high-power fiber laser technology with high-speed precision galvanometer control. It enables ultra-fine, high-speed micro-hole processing on thin sheet materials, with a minimum hole diameter of 0.02mm and positioning accuracy up to 2μm. It is widely suitable for precision drilling needs in industries such as electronics, automotive, aerospace, and medical devices, offering a cost-effective solution for micron-level micro-hole processing.
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Key Features
  • Single-mode fiber laser with excellent reflection isolation and diffraction-limited beam quality.
  • High-precision servo cutting head with auto-focus and fast response.
  • Superior beam quality and spot control via precision optical path.
  • Linear gantry dual-drive platform with acceleration exceeding 1G.
  • High-precision 5-axis control system with path optimization.
  • Ultra-high-speed drilling mode exceeding 50 holes per second.
  • Off-axis visual positioning system for secondary part processing.
  • High-flatness marble platform with a fully enclosed stable structure.
  • Maintenance-free operation through superior cable management and dust removal.
  • Minimum kerf down to 0.05mm with smooth cuts and no slag; supports rotary axis for tube processing.
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Scope of Expertise
Focusing on technical services, technology development, and exchange, the operation spans across computer software and hardware wholesale, import and export of advanced technologies, and specialized credit information consulting. Expertise includes graphic design, sales of functional glass, new optical materials, optical instruments, and specialized semiconductor device equipment. The portfolio further extends to experimental analysis instruments, CNC machine tools, electronic components, electromechanical equipment, metal cutting and welding solutions, fiber optics, and photovoltaic components.
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Technical Parameters
Category Parameter FM -LPCD1500/3000
LaserWavelength1060~1080nm
LaserPeak Power1500W (3000W)
LaserModulation Frequency1~50kHz
LaserBeam Quality M²<1.05
XY StageTravel600*600mm / 800*800mm
XY StageRepeatability≤±0.005mm
XY StageAcceleration≤1G
XY StageSpeed≤60m/min
Z AxisTravel150mm
Z AxisRepeatability≤±10μm
ProcessingMin Hole Diameter0.05mm
ProcessingThickness≤2mm (5mm)
ProcessingAccuracy≤±0.02mm
DrillingHigh-Speed Drilling>50 holes/s
EnvironmentOperating Temp1~30ºC
PhysicalDimensions1500*1600*1900mm
PhysicalWeight1500Kg
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Detailed Photos
Frequently Asked Questions
What is the minimum hole diameter this system can achieve?
The system can process ultra-fine micro-holes with a minimum diameter as small as 0.02mm, depending on material thickness.
How fast can the system drill holes?
In its high-speed drilling mode, the equipment can exceed speeds of 50 holes per second for hole diameters between 0.02mm and 0.2mm.
Which materials are compatible with this laser system?
The system is highly effective for processing various metals, alloys, and ceramic materials.
What makes the positioning so accurate?
It utilizes a high-precision off-axis visual positioning system and a linear gantry dual-drive platform, achieving positioning accuracy up to ±0.01mm.
Can this machine handle non-flat parts?
Yes, with the addition of a rotary axis, the system can enable circular tube cutting and drilling in addition to flat sheet processing.
What are the cooling and power requirements?
The system uses efficient air cooling and requires a power supply of 220V 50~60Hz with a total power consumption of ≤5kW.

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