Next-Gen Sic Power Solutions for Efficient EV Charging

Customization:	Available
After-sales Service:	Provide
Warranty:	12 Months

📊 Basic Information

Model NO.

SiC power devices

Product Name

Sic Material Preparation Equipment

Application

Sic Power Devices

Certification

ISO

Condition

New

Package

Customized or Wooden Box

Specification

Standard Specifications

Origin

China

🛠️ Product Description

The production process equipment and application of silicon carbide materials are core focuses of third-generation semiconductor technology. Utilizing independently developed core equipment such as long crystal furnaces, laser glass equipment, and epitaxial furnaces, we provide integrated solutions for silicon carbide materials, processes, and equipment systems, supporting the rapid advancement of the semiconductor industry.

SiC Material Preparation Equipment

SiC power devices are essential for electric vehicles, charging piles, photovoltaic inverters, high-speed rail, smart grids, and industrial power supplies, serving as advanced replacements for silicon-based MOSFETs and IGBTs.

Field	SiC Device Advantages	Comparison with Si Devices	Typical Applications
Electric Vehicles (EVs)	Higher efficiency: 5-10% longer range.	Lower switching losses compared to standard Si.	Inverters, On-board chargers.

⚡ SiC Chip Production Line

Chip and Module Specifications

Products: SiC Schottky diode chips, silicon carbide MOSFET chips and modules.

Application area: Power grids, electric traction, power supplies, household appliances, medical equipment, and consumer electronics. Primarily focused on photovoltaics, EV charging piles, and power electronic transformers.

🌐 Exhibition & Industry Integration

Engaged in international trade and semiconductor industry equipment integration since 2019, equipment solutions are exported to over 30 countries. We focus on providing high-cost-effective products and risk avoidance for global suppliers.

Main Product Range:

Die Bonder & Wire Bonding
Laser Marking (ID IC Wafer)
Laser Grooving & Cutting (Glass Ceramics Wafers Packaging)
Laser Internal Modification Machines (Si/Sic, Lt/Ln Wafers)
Laser Annealing Machines for Si/Sic
Automatic Dicing Saw Machines & Silicone Dispensing Equipment

📦 Packaging & Shipping

❓ Frequently Asked Questions

How to choose a suitable machine?

Please provide details regarding your workpiece material, size, and required functions. Based on our experience, we will recommend the most suitable configuration for your production needs.

What is the warranty period for the equipment?

We provide a one-year warranty along with 24-hour online professional technical support to ensure smooth operation.

What are the primary applications for SiC power devices?

They are widely used in electric vehicles (EVs), charging piles, photovoltaic inverters, high-speed rail, smart grids, and medical equipment.

What types of SiC chips do you provide?

Our lineup includes SiC Schottky diode chips, as well as silicon carbide MOSFET chips and modules designed for high-efficiency power electronics.

Do you offer integrated solutions for semiconductor production?

Yes, we provide integrated solutions that cover silicon carbide materials, processing techniques, and complete equipment systems including epitaxial furnaces and annealing machines.

What kind of laser processing equipment is available?

We offer a range of specialized equipment including laser marking for wafers, laser grooving, internal modification machines for Si/SiC, and laser annealing systems.