Cutting-Edge Sic Material Processing Solutions for Manufacturing Efficiency

Customization: Available
After-sales Service: Provide
Warranty: 12 Months

Product Description

Basic Information

Model NO.
SiC material preparation equipment
Product Name
Sic Material Preparation Equipment
Application
Sic Power Devices
Certification
ISO
Condition
New
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Origin
China

Product Description

The production process equipment and application of silicon carbide materials are core industries focusing on third-generation semiconductor technology. Relying on independently developed core processes and equipment such as long crystal furnaces, laser glass equipment, and epitaxial furnaces, we provide integrated solutions for silicon carbide materials, processes, and equipment systems, helping the rapid development of the third-generation semiconductor industry.

SiC preparation equipment

SiC Material Preparation & Production Line

SiC power devices are used in electric vehicles, charging piles, photovoltaic inverters, high-speed rail, rail transit, smart grid, industrial power supply and other fields, and can gradually replace silicon-based MOSFET and IGBT.

SiC Chip Production Line

SiC chip production line

SiC Chip and Module

Product: SiC Schottky diode chip, silicon carbide MOSFET chip and module.

Application Area

Includes power grid, electric traction, power supply, electric vehicles, household appliances, medical equipment and consumer electronics. SiC products are mainly used in photovoltaic, electric vehicle charging piles, and power electronic transformers.

SiC application 1
SiC application 2
SiC application 3

Exhibition & Customers

Exhibition photo 1
Exhibition photo 2

Mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently exported to over 30 countries, with over 200 customers and suppliers, aiming to provide high cost-effective products and risk avoidance for partners.

Main Products: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si/Sic Wafer, Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine), Automatic Silicone Dispensing Equipment.

Packaging & Shipping

Packaging details

FAQ

How to choose a suitable machine?
You can tell us the working piece material, size, and the requested machine function. We will recommend the most suitable machine based on our extensive experience.
What is the warranty period for the equipment?
We provide a one-year warranty and 24-hour online professional technical support to ensure your production remains efficient.
What are the primary applications for SiC power devices?
SiC power devices are widely used in electric vehicles, charging piles, photovoltaic inverters, high-speed rail, smart grids, and industrial power supplies.
What types of SiC chips do you provide?
Our production line covers SiC Schottky diode chips, as well as silicon carbide MOSFET chips and modules.
Do you offer solutions for semiconductor material preparation?
Yes, we provide integrated solutions including long crystal furnaces, epitaxial furnaces, and laser equipment for SiC material processing.
How is the equipment packaged for international shipping?
We use customized packaging or standard wooden box packaging to ensure the equipment is protected during sea or air transport.

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