High-Precision UV Laser Marking System for PCBA Components

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

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Basic Specifications

Model NO.	PCBA-01
Product Name	PCBA & IC & Wafer Marking Machine
Laser Visibility	Visible
Applicable Material	Metal
Cooling System	Air Cooling
Technical Class	Continuous Wave Laser
Laser Wavelength	UV Laser, CO2 Laser
Marking Method	Scanning Marking
Feature	Guaranteed Quality, Customized According to Needs
Origin	China

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Product Description

Brief Description: Applicable for the packaged IC marking of DIP, QFN and BGA components. This high-precision system ensures stable output and intelligent inspection.

Key Features

✔ Fully-automatic loading and unloading from hanging basket, stable laser output, intelligent vision direction inspection.
✔ User-friendly HMI (Human-Machine Interface) for easy operation.
✔ Multiple laser options: 20W Fiber laser (Imported), Green laser, UV laser, or CO2 laser.
✔ Advanced fume removal device to protect the marking environment and extract dust quickly.
✔ Compliance with CE MARK and SEMI industrial standards.

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Technical Parameters

Machine Model	HDZ-SIC100	HDZ-SIC200
Marking Scope	320mm*160mm	320mm*160mm
Product Spec	L: 160-320mm; W: 30-80mm	L: 160-320mm; W: 30-80mm
Font Support	TFT and SHX with font library module modification
Positioning Precision	±0.1mm	±0.1mm
UPH (Idle)	1200 pieces/h	1200 pieces/h
Power Supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Dimension	252516652000mm	251514202000mm

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Exhibition & Gallery

Our semiconductor equipment is utilized in over 30 countries by more than 200 customers and suppliers globally, focusing on high-precision processing and quality control.

Core Product Range: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers), Automatic Dicing Saw Machine, and Silicone Dispensing Equipment.

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Packaging & Shipping

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Frequently Asked Questions

Q1: How to choose a suitable machine?

You can provide the working piece material, size, and required machine functions. We will recommend the most suitable configuration based on our extensive industry experience.

Q2: What is the warranty period for the equipment?

We provide a one-year warranty along with 24-hour online professional technical support to ensure your production remains uninterrupted.

Q3: Which laser sources are available for this system?

The machine supports various laser sources including 20W Fiber laser, UV laser, Green laser, and CO2 laser to meet different material marking requirements.

Q4: What types of IC packaging are compatible with the marking system?

This equipment is specifically designed for high-precision marking on DIP, QFN, and BGA packaged ICs, as well as wafers and PCBA components.

Q5: Does the machine comply with international safety standards?

Yes, the equipment complies with both CE MARK and SEMI industrial standards, ensuring high safety and quality performance in semiconductor environments.

Q6: How does the system handle dust and fumes during marking?

The system is equipped with a specialized fume removal device that quickly extracts smoke and dust produced during the laser marking process to protect the internal environment.